Semiconductor-on-insulator with back side support layer

ABSTRACT

Embodiments of the present invention provide for the provisioning of efficient support to semiconductor-on-insulator (SOI) structures. Embodiments of the present invention may additionally provide for SOI structures with improved heat dissipation performance while preserving the beneficial electrical device characteristics that accompany SOI architectures. In one embodiment, an integrated circuit is disclosed. The integrated circuit comprises a silicon-on-insulator die from a silicon-on-insulator wafer. The silicon on insulator die comprises an active layer, an insulator layer, a substrate, and a strengthening layer. The substrate consists of an excavated substrate region, and a support region, the support region is in contact with the insulator layer. The support region and the strengthening layer are configured to act in combination to provide a majority of a required stabilizing force to the silicon-on-insulator die when it is singulated from the silicon-on-insulator wafer.

CROSS-REFERENCE TO RELATED APPLICATIONS

This patent application claims the benefit of U.S. Provisional PatentNo. 61/225,914 filed Jul. 15, 2009. The content of U.S. ProvisionalPatent No. 61/225,914 is incorporated herein by reference.

FIELD OF THE INVENTION

The invention described relates to semiconductor-on-insulator devicesand processing generally, and more specifically to providing structuralsupport to the active layer in semiconductor-on-insulator devices.

BACKGROUND OF THE INVENTION

Semiconductor-on-insulator (SOI) technology was first commercialized inthe late 1990s. The defining characteristic of SOI technology is thatthe semiconductor region in which circuitry is formed is isolated frombulk substrate by an electrically insulating layer. This insulatinglayer is typically silicon-dioxide. The reason silicon-dioxide is chosenis that it can be formed on a wafer of silicon by oxidizing the waferand is therefore amenable to efficient manufacturing. The advantageousaspects of SOI technology stem directly from the ability of theinsulator layer to electronically isolate the active layer from bulksubstrate. As used herein and in the appended claims, the region inwhich signal-processing circuitry is formed on an SOI structure isreferred to as the active layer of the SOI structure.

SOI wafer 100 is shown in FIG. 1. The wafer includes substrate layer101, insulator layer 102, and active layer 103. The substrate istypically a semiconductor material such as silicon. Insulator layer 102is a dielectric which is often silicon-dioxide formed through theoxidation of substrate layer 101. Active layer 103 includes acombination of dopants, dielectrics, polysilicon, metal layers,passivation, and other layers that are present after circuitry 104 hasbeen formed therein. Circuitry 104 may include metal wiring; passivedevices such as resistors, capacitors, and inductors; and active devicessuch as transistors. As used herein and in the appended claims, the“top” of SOI wafer 100 references top surface 105 while the “bottom” ofSOI wafer 100 references bottom surface 106. This orientation schemepersists regardless of the relative orientation of SOI wafer 100 toother frames of reference, and the removal of layers from, or theaddition of layers to SOI wafer 100. Therefore, active layer 103 isalways “above” insulator layer 102. In addition, a vector originating inthe center of active layer 103 and extending towards bottom surface 106will always point in the direction of the “back side” of the SOIstructure regardless of the relative orientation of SOI wafer 100 toother frames of references, and the removal of layers from, or theaddition of layers to SOI wafer 100.

Semiconductor devices are most commonly produced in bulk on large waferscomprising many individual devices which are called die. Bulk processingis one of the reasons semiconductor manufacturing is characterized byminimal variable cost production. Dice are not processed individuallyuntil very late in the overall manufacturing process. The process bywhich the individual dice are taken from the wafer is calledsingulation. Standard singulation methods include wafer saw, scribe andbreak, laser cutting, and other methods. All of these singulationmethods have the potential to cause stress on the individual die, andcould also possibly cause defects in any resultant device. SOI devicesare particularly susceptible to these types of manufacturing errorsbecause the active layer is thin, and therefore less able to protect thecontained circuitry as compared to the thicker bulk substrates used intraditional semiconductor devices. Stress induced during singulation maycause plastic deformation of the active circuitry and wafer warpagewhich may result in silicon crystal defects such as slip and dislocationgeneration. These conditions will significantly decrease the electricalperformance and product yield of a resulting device.

Various methods exist to provide stability to circuitry duringprocessing. A prominent approach involves the attachment of a supportstructure to the wafer before individual die on the original wafer arethinned or singulated. For example, a supporting handle wafer may beattached to the active layer to add support to the active layer duringsingulation or thinning. This handle wafer will usually remain on theactive layer and form a part of the final device. Another approach tothe problem of providing stability to traditional semiconductor devicesduring thinning is to selectively thin a framework of wafer material ina border around a subset of die. This approach allows the substrate ofindividual devices to be thinned while still being supported in groupsfor further processing.

SUMMARY OF INVENTION

In one embodiment of the invention, an integrated circuit is disclosed.The integrated circuit comprises a silicon-on-insulator die from asilicon-on-insulator wafer. The silicon-on-insulator die is comprised ofan active layer, an insulator layer, and a substrate. The substrateconsists of an excavated substrate region and a support region. Thesubstrate region is in contact with the insulator layer. The supportregion is configured such that it provides a majority of a requiredstabilizing force to the silicon-on-insulator die when it is singulatedfrom the silicon-on-insulator wafer.

In another embodiment of the invention, an integrated circuit isdisclosed. The integrated circuit comprises a silicon-on-insulator diefrom a silicon-on-insulator wafer. The silicon-on-insulator die iscomprised of an active layer, an insulator layer, a substrate, and astrengthening layer. The substrate consists of an excavated substrateregion and a support region. The strengthening layer is disposed in theexcavated substrate region. The substrate region is in contact with theinsulator layer. The support region and the strengthening layer areconfigured to act in combination to provide a majority of a requiredstabilizing force to the silicon-on-insulator die when it is singulatedfrom the silicon-on-insulator wafer.

In another embodiment of the invention, a method of fabricating anintegrated circuit is disclosed. The method comprises a step of formingactive circuitry of the integrated circuit in an active layer of asilicon-on-insulator wafer. The method additionally comprises a step ofremoving a portion of the substrate from a silicon-on-insulator die onthe silicon-on-insulator wafer to form an excavated substrate region inthe substrate, and a support region in the substrate. The methodadditionally comprises a step of singulating the silicon-on-insulatordie from a handle-free silicon-on-insulator wafer.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a block diagram of an SOI device that is inaccordance with the prior art.

FIG. 2 illustrates a block diagram of an SOI structure with a substratesupport region that is in accordance with the present invention.

FIG. 3 illustrates a block diagram of a bottom-up view of an SOIstructure with a substrate support region that is in accordance with thepresent invention.

FIG. 4 illustrates a process flow chart of a method of fabricating anintegrated circuit that has a substrate support region that is inaccordance with the present invention.

FIG. 5 illustrates a bottom-up view of an SOI wafer having individualdie with substrate support regions that is in accordance with thepresent invention.

FIG. 6 illustrates a block diagram of an SOI structure having astrengthening layer that is in accordance with the present invention.

FIG. 7 illustrates a block diagram of an SOI structure having astrengthening layer in contact with the SOI active layer that is inaccordance with the present invention.

FIG. 8 illustrates a block diagram of an SOI structure having astrengthening layer on a strengthening layer substrate that is inaccordance with the present invention.

FIG. 9 illustrates a block diagram of an SOI structure having astrengthening layer comprising a bond wire that is in accordance withthe present invention.

FIG. 10 illustrates a process flow chart of a method of fabricating anintegrated circuit that has a strengthening layer that is in accordancewith the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Reference now will be made in detail to embodiments of the disclosedinvention, one or more examples of which are illustrated in theaccompanying drawings. Each example is provided by way of explanation ofthe present technology, not as a limitation of the present technology.In fact, it will be apparent to those skilled in the art thatmodifications and variations can be made in the present technologywithout departing from the spirit and scope thereof. For instance,features illustrated or described as part of one embodiment may be usedwith another embodiment to yield a still further embodiment. Thus, it isintended that the present subject matter covers such modifications andvariations as are within the scope of the appended claims and theirequivalents.

Embodiments of the present invention provide for the provisioning ofefficient support to SOI structures. This support may be provided to SOIstructures throughout the manufacturing process and when the SOIstructure is deployed as an independent device. Embodiments of thepresent invention may additionally provide for improved heat dissipationperformance while preserving the beneficial electrical devicecharacteristics that accompany SOI architectures. In addition, deviceswith the aforementioned benefits can be manufactured in accordance withthe present invention with very little modification to manufacturingprocesses that are used most often in the semiconductor industry. Thisis a huge advantage given that compatibility with existing manufacturingprocesses avoids the need for the nearly insurmountable fixed productioncost investments that can face novel semiconductor solutions.Embodiments of the invention achieve these results through theutilization of back side processing; the removal of portions of the SOIsubstrate layer, the optional partial or complete removal of the SOIinsulator layer, and the optional partial or complete deposition ofstrengthening layers in variant configurations on the back side of theSOI structure.

An SOI structure that is in accordance with the present invention can bedescribed with reference to FIG. 2. FIG. 2 displays a cross-sectionalview of SOI die 200 which comprises active layer 103, insulator layer102, and substrate 101. SOI die 200 has been singulated from SOI wafer100. Substrate 101 consists of excavated substrate region 201, andsupport region 202. Support region 202 is in contact with insulatorlayer 102. Support region 202 is configured to provide a majority of arequired stabilizing force to SOI die 200 when SOI die 200 is singulatedfrom SOI wafer 100. Thereby, individual die can be reliably singulatedfrom SOI wafer 100 in the absence of a separate support structurewithout suffering stress related damage.

A pattern for support region 202 that is in accordance with the presentinvention can be described with reference to FIG. 3. FIG. 3 displays abottom-up view of SOI die 200. Substrate material has been removed fromsubstrate 101 to form excavated substrate region 201 which exposesinsulator layer 102, and is surrounded by a border of remainingsubstrate material that forms support region 202. In specificembodiments of the invention, substrate material in excavated substrateregion 201 is not completely removed, but rather the substrate inexcavated substrate region 201 is merely thinned. These embodimentsenable a balance between thermal dissipation characteristics and supportcharacteristics as desired. In specific embodiments of the invention,excavated substrate region 201 is formed into more complex patterns thana standard frame. These embodiments enable a balance between thermaldissipation characteristics, electrical characteristics, and supportcharacteristics as described below.

Removing substrate material to form support region 202 and excavatedsubstrate region 201 provides advantageous characteristics to die 200.When the substrate of a wafer has been removed, the thermal dissipationcapabilities of the die are significantly improved because heat does notneed to diffuse through the substrate to escape the vicinity of activelayer 103. However, in embodiments where the entire substrate isremoved, the remaining wafer holding the active layer is very thin. Insome processes, the remaining wafer will be only 10 micrometers (μm)thick. As described previously, this remaining wafer would be physicallyfragile and prone to breakage. However, support region 202 can providestructural strength to the die so that the wafer remains structurallysound for further processing. In addition, leaving support region 202 inspecific patterns can improve the electrical performance of thecircuitry formed in active layer 103. Furthermore, the support offeredby support region 202 can eliminate drawbacks associated with additionalsupport structures such as handle wafers. Since support region 202remains part of the individual die even after singulation, an integratedcircuit in accordance with specific embodiments of the invention can beprocessed further on either the front or back side and electricalcontacts can be made to circuitry in active layer 103 from either sideas well.

In specific embodiments of the invention, insulator layer 102 is alsoremoved to form an excavated insulator region. These embodiments offerenhanced thermal dissipation characteristics as insulator layer 102 isusually much less thermally conductive than substrate 101. As mentionedpreviously, silicon-dioxide is the ubiquitous insulator layer in modernSOI technology. At a temperature of 300 degrees Kelvin (K),silicon-dioxide has a thermal conductivity of roughly 1.4 Watts permeter per Kelvin (W/m*K). A bulk silicon substrate at the sametemperature has a thermal conductivity of roughly 130 W/m*K. Therefore,removal of the insulator region can greatly enhance the thermaldissipation capabilities of a device in accordance with theseembodiments.

The excavated insulator region and excavated substrate region do nothave to be contiguous, but rather insulator layer 102 and substrate 101can be patterned in various ways to expose different portions of thelayer above. In specific embodiments of the invention, substrate 101 andoxide layer 102 are removed in various patterns. In specific embodimentsof the invention, these patterns are identical, while in others they arenot. Removing insulator layer 102 can cause significant harm to anycircuitry that lies above it. Therefore, in specific embodiments of theinvention, insulator layer 102 is patterned to leave insulator materialbelow active devices in active layer 103. These embodiments thereforeenable a balance between thermal dissipation characteristics, supportcharacteristics, and electrical performance characteristics as desired.In specific embodiments of the invention, oxide layer 102 is not totallyremoved but is instead thinned in the excavated insulator region.

In specific embodiments of the invention, the excavated substrate regioncovers a majority of a signal-processing region on the SOI die. Thesignal-processing region of an SOI die is generally the region of thedie in which the most heat is generated. A die's thermal dissipationcapabilities are therefore greatly enhanced by removing the substratedirectly under the signal-processing region, and this benefit improveswith the more the region is exposed. Although the strengtheningcharacteristic of the substrate region also diminishes, a highlyadvantageous trade-off point is met when excavated substrate region 201exceeds a majority of the total area covered by the signal-processingregion of the SOI die.

A method of fabricating an integrated circuit that is in accordance withthe present invention can be described with reference to FIG. 4. Inspecific embodiments of the invention, a method for producing anintegrated circuit begins in step 400 with the preparation of an SOIwafer for processing. This step can comprise the actual production of anSOI wafer consisting of a layer of active silicon above asilicon-dioxide insulator as produced using SIMOX or implant and cutmethods. This step could also comprise the purchase of a prefabricatedSOI wafer and its preparation for further processing.

In specific embodiments of the present invention, the preparation of SOIwafer in step 400 is followed in step 401 by forming active circuitry inthe active layer of the SOI wafer. The circuitry formed during this stepand in this layer can include but is not limited to technologies such asCMOS, BiCMOS, SiGe, GaAs, InGaAs, and GaN. The circuitry can comprise:various active devices such as diodes and transistors; various passivedevices such as resistors, capacitors, and inductors; and routingcircuitry such as metal wires and vias. Various photolithographic andchemical deposition steps can be conducted to formulate this circuitry.

In specific embodiments of the invention, the formation of activecircuitry in the active layer of the SOI wafer is followed in step 402by the removal of substrate from the back side of the SOI wafer usingback side processing. In specific embodiments of the invention, thesubstrate is removed using mechanical and chemical means independentlyor in combination. For example, mechanical grinding can be used to thinthe substrate material from an original thickness of approximately 800micro-meters (μm) to approximately 20 μm. In specific embodiments of theinvention, step 402 is achieved by the use of mechanical grinding toremove most of the substrate material and the final 1-10 μm are removedusing a plasma etch or a wet etch. If the substrate is silicon, thefinal thickness of substrate material may be removed with a wet etchsuch as KOH or TMAH. The final thickness of substrate material may alsobe removed using a dry plasma etch. The substrate can be removed with ahigh precision or etch rate ratio. The etch rate ratio refers to theratio of the rate of desired substrate material that was removed fromthe back of the wafer to the rate of additional material that wasremoved which should not have been removed. In specific embodiments ofthe invention, the insulator layer is a buried-oxide that acts as anetch stop since the etch rate ratio can be extremely high for theremoval of all the substrate up to the buried oxide.

In specific embodiments of the invention, the removal of substratematerial in step 402 is executed so as to form any of the patternedstructures described above. In specific embodiments of the inventioncapable of achieving this result, a masking material is left in apattern around the perimeter of each die. This pattern is repeated oneach die on the wafer. Alignment to the dice that are present on thefront side of the wafer can be accomplished using infrared alignment,X-ray alignment, dual-face optical alignment, or other suitablealignment scheme. Substrate material is then preferentially etched usingmethods described previously while leaving the masking materialsubstantially un-etched. In a specific embodiment of the invention, themasking material is a photoresist. In another specific embodiment, themasking material is a so-called hard mask of silicon dioxide, siliconnitride, or other suitable material.

In specific embodiments of the invention, the removal of substratematerial in step 402 is followed by removal of the SOI insulator layerto form an excavated insulator region in step 403. As mentionedpreviously, the insulator layer may be removed altogether, merelythinned overall and left thinner than its original thickness, or may beremoved in such a way that the excavated insulator layer forms any ofseveral patterns as described above. These patterns can be formed usingstandard photolithographic techniques or selective chemical vapordeposition. Thinning the insulator layer must be done carefully to avoiddamaging the active layer. Although only a mono-layer—on the order of 1nm—of insulator material is needed, thinning may be limited by theuniformity of the original insulator. For example, traditional methodsfor insulator removal would not be able to leave a final layer of lessthan 5 nm if the initial layer had variations of greater than 5 nm tobegin with. Additionally, these patterns can be configured to capitalizeon beneficial tradeoffs in the degree to which circuitry in the activelayer is shielded and the degree to which the resultant SOI structureefficiently dissipates heat.

Following the removal of substrate material from each die in step 402and the optional removal of insulator material in step 403, theindividual die are singulated in step 404. At this point, a pattern ofthick substrate is present repeating on the back of each die. Inspecific embodiments of the invention, this repeating pattern will be asshown in FIG. 5. In FIG. 5, SOI wafer 500 is shown from the back sidehaving a grid-like pattern comprised of the support regions of variousindividual die 501 wherein each segment of the grid is occupied by anindividual die such as die 502. The individual die can be singulatedusing standard singulation methods such as wafer saw, scribe and break,or laser cutting. In specific embodiments of the invention, the supportregion is configured to provide a majority of a required stabilizingforce to each individual SOI die during the singulation process. Thesupport region will therefore remain in contact with the individual diethroughout the process and remain after the die has been separated fromthe wafer. In specific embodiments of the invention, the materialforming the support region will remain with the die as it is deployed asan individual device. In specific embodiments of the invention, prior tosingulation an epoxy with high thermal conductivity is applied to fillany remaining hollow die cavity that was formed during back sideprocessing and thereby present a planar back surface to simplify laterhandling of the wafer and singulated die

An SOI structure that is in accordance with the present invention can bedescribed with reference to FIG. 6. FIG. 6 displays a cross-sectionalview of SOI die 200 which comprises active layer 103, insulator layer102, substrate 101, and strengthening layer 600. SOI die 200 has beensingulated from SOI wafer 100. Substrate 101 consists of excavatedsubstrate region 201, and support region 202. Support region 202 is incontact with insulator layer 102. Support region 202 and strengtheninglayer 600 are configured to act in combination to provide a majority ofa required stabilizing force to SOI die 200 when SOI die 200 issingulated from SOI wafer 100. In accordance with these embodiments, inthe absence of a separate support structure individual die can bereliably singulated from SOI wafer 100 without suffering stress relateddamage.

Strengthening layer 600 can be comprised of various materials and can bedeposited in various configurations in accordance with the presentinvention. In specific embodiments of the invention, strengthening layer600 can be deposited over the entire back surface of SOI wafer 100. Inaddition, strengthening layer 600 can be deposited in portions of theback surface. As described previously, substrate 101 can be removedaccording to certain patterns to allow for tradeoffs in terms ofelectrical performance characteristics, support characteristics, andthermal dissipation characteristics. In specific embodiments of theinvention, the patterns in which substrate 101 is removed do not matchthe patterns in which strengthening layer 600 is deposited. In specificembodiments of the invention, strengthening layer 600 is congruent withexcavated substrate region 201 such that the SOI die takes on the sameoverall shape as before substrate 101 was removed. Strengthening layer600 can be comprised of any material with high fracture strength or highflexural strength. For example, strengthening layer 600 could bediamond, diamond-like carbon, or silicon carbide. Strengthening layer600 can also be selected to improve the thermal dissipation performanceof SOI die 200. In specific embodiments of the invention, strengtheninglayer 600 comprises a material having high thermal conductivity. Forexample, strengthening layer 600 could be diamond, diamond-like carbon,silicon carbide, aluminum oxide, aluminum nitride, beryllium oxide,beryllium nitride, or carbon nanotubes. As used herein and in theappended claims, a layer of material has high thermal conductivity ifits thermal conductivity is greater than 50 W/m*K. In specificembodiments of the invention, the strengthening layer can consist ofmore than one layer. For example, a thin layer of very high thermalconductivity material such as diamond-like carbon or carbon nanotubescould be applied in contact with layer 102. Then, ahigh-thermal-conductivity material such as epoxy could be applied overthe first high thermal conductivity layer, providing flexural strengthand physical protection of the first layer, and possibly a planar backsurface to simplify handling of the wafer and singulated die. The first,very high thermal conductivity layer, in close proximity to theheat-producing areas of the die, can act to spread heat laterally on thedie, while the second, thicker, high conductivity material layer can actto further spread heat laterally and to conduct heat to the back of thedie from which it can be transported away from the die.

Removing substrate material to form support region 202 and excavatedsubstrate region 201 while at the same time depositing strengtheninglayer 600 provides significant advantageous characteristics to die 200.In general, the removal of substrate 101 and the deposition of amaterial for strengthening layer 600 with high thermal conductivity canimprove the thermal dissipation performance of SOI die 200. Inparticular, the design constraints caused by the trade-offs associatedwith enhanced thermal dissipation and support are alleviated becausestrengthening layer 600 can offer additional support while at the sametime providing a highly thermally conductive path for heat to dissipateaway from active layer 103.

An SOI structure that is in accordance with the present invention can bedescribed with reference to FIG. 7. FIG. 7 displays a cross-sectionalview of SOI die 200 which comprises substrate 101, insulator layer 102,active layer 103, and strengthening layer 600. The structure displayedin FIG. 7 is similar to that described with reference to FIG. 6 exceptthat it additionally comprises excavated insulator region 700 in whichstrengthening layer 600 is disposed.

As described previously, insulator 102 can be removed according tocertain patterns to allow for tradeoffs in terms of electricalperformance characteristics, support characteristics, and thermaldissipation characteristics. In specific embodiments of the invention,the patterns in which insulator 102 is removed do not match the patternsin which strengthening layer 600 is deposited. In a specific embodiment,excavated insulator layer 700 spans the entire back surface of SOI die200. In specific embodiments of the invention, strengthening layer 600is congruent with excavated substrate region 201 in combination withexcavated insulator region 700 such that the SOI die takes on the sameoverall shape as before substrate 101 was removed. Embodiments mentionedpreviously wherein strengthening layer 600 is thermally conductive areof particular utility when combined with embodiments in accordance withFIG. 7. Since insulator layer 102 is generally thermally insulating, thethermal dissipation performance of these embodiments is greatly enhancedby placing a thermally conductive material in close proximity to activelayer 103. In specific embodiments of the invention, strengthening layer600 has high thermal conductivity and is also electrically insulating.Strengthening layer 600 is advantageously electrically insulating wheninsulator layer 102 has been removed in such a pattern that it liesdirectly under active devices in active layer 103. If strengtheninglayer 600 is not electrically insulating, the electrical characteristicsof the active devices in active layer 103 could otherwise besignificantly degraded.

There are various specific patterns for excavated oxide region 700 andstrengthening layer 600 in relation to active layer 103 that can providesignificant benefits. In a specific embodiment of the invention,excavated insulator region 700 is at least partially laterallycoextensive with a lowest layer of metal wiring in active layer 103. Inspecific embodiments of the present invention, this lowest metal layeris the lowest layer of wiring for the circuitry formed in active layer103. This configuration is highly advantageous from a balancingperspective in that metal wires will not generally suffer from alteredelectrical characteristics if they are not placed on an insulator. Inaddition, metal is highly thermally conductive, and metal wiring usuallylinks to active devices making these metal lines highly efficientchannels for thermal dissipation. Although a vast majority of the heatgenerated in active layer 103 is generated by active devices, heat willdissipate from these active devices to the metal lines and then outthrough the back of the SOI structure. In another embodiment of theinvention, excavated insulator layer 700 is laterally coextensive withportions of active device in active layer 103.

An SOI structure that is in accordance with the present invention can bedescribed with reference to FIG. 8. FIG. 8 displays a cross-sectionalview of SOI wafer 100 which comprises substrate 101, insulator layer102, active layer 103, strengthening layer 600, and strengthening layerwafer 800. As mentioned previously, in specific embodiments of theinvention, strengthening layer 600 will be congruent with thecombination of excavated substrate region 201 and excavated insulatorregion 700. Also, as is mentioned previously, strengthening layer 600may be thermally conductive, and excavated insulator region 700 may belaterally coextensive with lowest layer of metal 801 in active layer103. The structure displayed in FIG. 8 exhibits these characteristics.Strengthening layer wafer 800 can be removed after or before singulationas described below. In another embodiment, strengthening layer wafer 800can be left permanently bonded to the SOI die to provide additionalphysical strength and/or thermal conduction. The resultant structure isalso shown in FIG. 8 as SOI die 200. In SOI die 200, each of the twopillars of strengthening layer 600 in FIG. 8 may act to both providestability to active layer 103, and to provide an efficient channel forheat to dissipate from active layer 103. In specific embodiments of theinvention, the two regions of strengthening layer 600 in FIG. 8 will beelectrically isolated to allow for effective thermal dissipation withoutdeleteriously affecting the performance of devices in active layer 103.

In specific embodiments of the invention, strengthening layer 600 takesthe form of variant thermally conductive channels in contact withthermal pads on the bottom surface of active layer 103. The thermallyconductive channels can spread out below active layer 103 in varyingpatterns including saw-tooth channels, sun-bursts, or square wavechannels. These thermally conductive channels can be formed by metalpillars which could be made of copper. These metal channels could be incontact with key areas of active layer 103 such as is shown in FIG. 8.In specific embodiments of the invention, strengthening layer 600 iscomprised of thermally conductive dielectric contacts directlyunderneath portions of active devices in active layer 103 that areconnected to metal pillars that form channels to the back side of SOIwafer 100. This configuration would allow for both electrical isolationof the devices in active layer 103, greatly enhanced thermal dissipationcapabilities due to close contact with active devices, and the ease ofmanufacturing afforded by use of strengthening layer substrate 800. Inspecific embodiments of the invention, the pillars of strengtheninglayer 600 are comprised of thermally conductive dielectric material thatforms channels to the back side of SOI wafer 100. The use of thermallyconductive dielectric material for the pillars would result in furtherimprovement in electrical isolation of the devices in active layer 103.

An SOI structure that is in accordance with the present invention can bedescribed with reference to FIG. 9. FIG. 9 displays a cross-sectionalview of SOI die 200 which comprises substrate 101, insulator layer 102,active layer 103, bond wire 900, and epoxy 901. As seen in FIG. 9,strengthening layer 600 can take the form of bond wires connected tothermally conductive dielectric contacts. Bond wires such as bond wire900 contact thermal contacts on the back side of active layer 103. Epoxy901 is disposed in the remaining cavity formed by excavated substrateregion 201. Bond wire 900 would allow for the dissipation of heat fromactive layer 103 out the back side of SOI die 200. This structure isadvantageous in that standard manufacturing processes are adept atconnecting bond wires to small area contacts. In addition, a single bondwire can create two separate isolated thermal channels since epoxy 901will hold the bond wire in place as it is severed. A process formanufacturing this structure is described below.

A method of fabricating an integrated circuit that is in accordance withthe present invention can be described with reference to FIG. 10. Inspecific embodiments of the invention, a method for producing anintegrated circuit begins in step 1000 with the preparation of an SOIwafer for processing, and continues with forming active circuitry in theactive layer of the SOI wafer in step 1001. Step 1000 and step 1001 canbe conducted in accordance with steps 400 and 401 respectively asdescribed above.

In specific embodiments of the present invention, the formation ofactive circuitry in the active layer of the SOI wafer in step 1001 isfollowed in step 1002 by the removal of substrate from the back side ofthe SOI wafer using back side processing. Step 1002 can be conducted inaccordance with step 402 as described above. In specific embodiments ofthe invention, step 1002 can be preceded by the temporary bonding of anSOI handle wafer to the SOI wafer being processed. Processes used toinduce a temporary bond to a handle wafer include adhesives such asBrewer Science HT 10.10, 3M's WSS (Wafer Support System), HD Micropolyimide, and TMAT. In accordance with these embodiments, a muchgreater amount of substrate material can be removed because thesubstrate is not needed to support the active layer. In theseembodiments, the strengthening layer that is deposited in step 1005 willultimately provide support to the active layer.

In specific embodiments of the invention, the removal of substratematerial in step 1002 is followed by removal of the SOI insulator layerto form an excavated insulator region in step 1003. Step 1003 can beconducted in accordance with step 403 as described above. In specificembodiments of the invention, this step is conducted so as to form anexcavated insulator region that is in accordance with any of therelevant structures previously discussed. In specific embodiments of theinvention, the insulator material is not removed at all, and the removalof substrate material 1002 is followed directly by the preparation of astrengthening layer wafer in step 1004 or the deposition of astrengthening layer to the back side of the SOI wafer in step 1005.

In specific embodiments of the invention, the removal of substratematerial in step 1002, and the optional removal of insulator material instep 1004 are followed by the preparation of a strengthening layer waferin step 1004. With reference to FIG. 8, this strengthening layer wafercomprises a strengthening layer such as strengthening layer 600 and astrengthening layer substrate such as strengthening layer substrate 800.In specific embodiments of the invention, the strengthening layer can bebonded to the strengthening layer substrate using a temporary bond suchas a dissolvable solvent or an adhesive that can be removed through aheat and slide process. These embodiments allow for the later removal ofstrengthening layer substrate 800 after strengthening layer 600 isapplied to SOI wafer 100. In other specific embodiments of theinvention, strengthening layer substrate 800 may be bonded permanentlyto strengthening layer 600. In these embodiments, strengthening layersubstrate 800 is advantageously thermally conductive as described above.In specific embodiments of the invention, the formation of strengtheninglayer 600 includes the deposition of metal channels on strengtheninglayer substrate 800. As described above, in specific embodiments of theinvention these metal channels may form a strengthening layer 600 thatis congruent with excavated substrate region 201 or the combination ofexcavated substrate region 201 with excavated insulator region 700. Inspecific embodiments of the invention, the formation of strengtheninglayer 600 would include the deposition of various materials onstrengthening layer substrate 800. For example, a first layer could bemetal channels to spread heat down away from active layer 103, a secondlayer could be a second layer of metal pillars to connect from thechannels up through insulator layer 102, and a third layer could be adielectric layer configured to be in contact with key areas of activelayer 103. The dielectric layer could isolate active device in activelayer 103 from the thermal channels, and could also act as a contaminantbarrier so that materials such as copper used for the metal channelswould not corrupt active layer 103. In this manner, any of thestrengthening layer structures described above can be formed in step1004.

In specific embodiments of the invention, the removal of substratematerial in step 1002, and the optional removal of insulator material instep 1003, is followed by the deposition of a strengthening layer on theback side of the active SOI wafer in step 1005. The deposition of thestrengthening layer in step 1005 is capable of forming an SOI wafer witha strengthening layer in accordance with any of the relevant structurespreviously discussed. In specific embodiments of the invention, thisstep is accompanied by the deposition of an epoxy to fill any remaininghollow die cavity that was formed during back side processing. Inspecific embodiments of the invention, step 1005 includes the depositionof thermal pads in the excavated substrate or insulator region. Thesethermal pads, as described above, may be dielectrics meant to protectkey areas of active layer 103. In a specific embodiment of theinvention, step 1005 includes the attachment of bond wires to thesethermal pads. This can be accomplished through standard bond wireconnection methods. In specific embodiments of the invention, one bondwire attaches to two thermal pads. The cavity that remains afterconnecting up the bond wires is filled with an epoxy which leaves thehighest point of the arch formed by the bond wire exposed. A final stepof processing involves cutting the bond wires at the surface of thedeposited epoxy. As described above, this results in two isolatedthermally conductive channels for each attached bond wire.

In specific embodiments of the invention, the preparation of astrengthening layer wafer in step 1004, is followed by the deposition ofa strengthening layer on the back side of the active SOI wafer in step1005. In specific embodiments of the invention, this step involvesaligning the active wafer with the strengthening layer wafer. The bondbetween the wafers can be formed by permanent organic or inorganicadhesives, oxide frit bonding, galvanic bonding, molecular fusionbonding, any form of electromagnetic bonding, and other methods forproducing wafer bonds. In specific embodiments of the invention wherethe strengthening layer wafer comprises a temporary strengthening layersubstrate, the strengthening wafer substrate can be removed during thisstep by dissolving the adhesive that bonded the temporary wafer orthrough a heat and slide technique. Dissolving the temporary bondingmaterial should be done using a solvent that does not attack thestrengthening layer itself. In specific embodiments of the invention,additional heating or compression may be required during this step toensure that a good bond was formed between the strengthening layer andthe active wafer.

In specific embodiments of the invention, the deposition of astrengthening layer in step 1005, is followed by the singulation ofindividual die from the SOI wafer in step 1006. Step 1006 can beconducted in accordance with step 403 above. In specific embodiments ofthe present invention, the strengthening layer and the support region ofthe substrate provide a majority of a required stabilizing force to saidsilicon-on-insulator die during step 1006.

Although embodiments of the invention have been discussed primarily withrespect to specific embodiments thereof, other variations are possible.Various configurations of the described system may be used in place of,or in addition to, the configurations presented herein. For example,although the devices were discussed often with reference to siliconsubstrates and oxide insulator layers the invention will function withany form of semiconductor-on-insulator wafers, structures, or devices.For example, the invention will function in combination withsilicon-on-sapphire structures. In addition, the invention can functionor operate upon circuitry using any form of technology such as CMOS,bipolar, BiCMOS, SiGe, Ga, As, InGaAs, GaN and any other form ofsemiconductor technology or compound semiconductor technology. Inaddition, there may be additional layers of materials disposed betweenthose layers mentioned herein. Semiconductor processing is a highlydetailed field, and layers were only mentioned herein if they wereabsolutely necessary to describe the invention to avoid confusion. Forexample, there may be layers of passivation disposed on the active layerto prevent the circuitry from reacting with its environment. Inaddition, the use of the word “layer” such as when describing an activelayer or a insulator layer does not preclude such layers being comprisedof more than one material. For example, there may be layers of glass, orsome other insulator below metal lines in active circuitry in additionto a silicon-dioxide insulator beneath the entire active layer of an SOIstructure. However, the term insulator layer can cover the entirestructure of the glass and silicon-dioxide insulator.

Those skilled in the art will appreciate that the foregoing descriptionis by way of example only, and is not intended to limit the invention.Nothing in the disclosure should indicate that the invention is limitedto systems that require a particular form of semiconductor processing orto integrated circuits. Functions may be performed by hardware orsoftware, as desired. In general, any diagrams presented are onlyintended to indicate one possible configuration, and many variations arepossible. Those skilled in the art will also appreciate that methods andsystems consistent with the present invention are suitable for use in awide range of applications encompassing any related to the structuralsupport of electronic or photonic devices.

While the specification has been described in detail with respect tospecific embodiments of the invention, it will be appreciated that thoseskilled in the art, upon attaining an understanding of the foregoing,may readily conceive of alterations to, variations of, and equivalentsto these embodiments. These and other modifications and variations tothe present invention may be practiced by those skilled in the art,without departing from the spirit and scope of the present invention,which is more particularly set forth in the appended claims.

What is claimed is:
 1. An integrated circuit comprising: asilicon-on-insulator die from a silicon-on-insulator wafer, saidsilicon-on-insulator die having an active layer, an insulator layer, anda substrate; wherein said substrate includes an excavated substrateregion and a support region, said support region being in contact withsaid insulator layer; and a strengthening layer providing an isolatedthermal dissipation channel that contacts a lowest layer of metal insaid active layer; wherein said strengthening layer comprises a materialwith high fracture strength or high flexural strength; and wherein saidsupport region and said excavated substrate region form a single framearound the silicon-on-insulator die.
 2. The integrated circuit fromclaim 1, wherein: said active layer has an area; and said excavatedsubstrate region covers a majority of said area of said active layer onsaid silicon-on-insulator die.
 3. The integrated circuit from claim 1,wherein said strengthening layer is disposed in said excavated substrateregion.
 4. The integrated circuit from claim 3, wherein said activelayer has an area; and said excavated substrate region covers a majorityof said area of said active layer on said silicon-on-insulator die. 5.The integrated circuit from claim 1, wherein said strengthening layerhas high thermal conductivity.
 6. The integrated circuit from claim 5,wherein said strengthening layer is congruent with said excavatedsubstrate region.
 7. The integrated circuit from claim 3, wherein: saidinsulator layer comprises an excavated insulator region; and saidstrengthening layer is disposed in said excavated insulator region. 8.The integrated circuit from claim 7, wherein said strengthening layerhas high thermal conductivity and is electrically insulating.
 9. Theintegrated circuit from claim 7, wherein said excavated insulator regionis laterally coextensive with said lowest layer of metal in said activelayer.
 10. The integrated circuit from claim 9, wherein saidstrengthening layer is congruent with a combination of said excavatedsubstrate region and said excavated insulator region.
 11. A method offabricating an integrated circuit, the method comprising the steps of:forming a silicon-on-insulator die from a silicon-on-insulator wafer,said silicon-on-insulator die having an active layer, an insulatorlayer, and a substrate; removing a portion of said substrate from saidsilicon-on-insulator die on said silicon-on-insulator wafer to form anexcavated substrate region in said substrate and a support region insaid substrate; depositing a strengthening layer on said excavatedsubstrate region; and singulating said silicon-on-insulator die fromsaid silicon-on-insulator wafer; wherein said strengthening layercomprises a material with high fracture strength or high flexuralstrength; and wherein said support region and said excavated substrateregion form a single frame around the silicon-on-insulator die.
 12. Themethod from claim 11, further comprising the step of: preparing astrengthening layer deposition wafer, said strengthening layerdeposition wafer comprising said strengthening layer and a strengtheningwafer substrate; wherein said strengthening layer has high thermalconductivity and is congruent with said excavated substrate region. 13.The method from claim 11, further comprising the step of removing aportion of an insulator layer from said silicon-on-insulator wafer toform an excavated insulator region.
 14. The method from claim 13,wherein said excavated insulator region is laterally coextensive with alowest layer of metal in said active layer.
 15. The method from claim14, further comprising the step of: preparing a strengthening layerdeposition wafer, said strengthening layer deposition wafer comprisingsaid strengthening layer and a strengthening wafer substrate; whereinsaid strengthening layer is congruent with a combination of saidexcavated substrate region and said excavated insulator region.
 16. Themethod from claim 15, said strengthening layer comprising: a set ofisolated thermal dissipation channels; wherein each of said isolatedthermal dissipation channels contacts said lowest layer of metal in saidactive layer.
 17. The method from claim 16, further comprising the stepof: removing said strengthening wafer substrate; wherein said removingsaid strengthening wafer substrate comprises dissolving a temporary bondmaterial.
 18. The integrated circuit from claim 1, wherein saidstrengthening layer comprises one of diamond, diamond-like carbon,silicon carbide, aluminum oxide, aluminum nitride, beryllium oxide,beryllium nitride, or carbon nanotubes.